Board Dimensions

5 cm × 7 cm (50 mm × 70 mm) - Rectangular prototype area

Material Composition

High-quality FR4 fiberglass substrate

Layer Configuration

Double-sided with 1 oz (35µm) copper cladding on both sides

Hole Pitch Standard

2.54mm (0.1 inch) grid spacing - Industry standard for through-hole components

Pad Specifications

Plated through-holes (PTH) with 1mm diameter (typical)

Surface Treatment

Bare copper or HASL (Lead-free) finish available

Thermal Properties

Tg 130-140°C (standard FR4)

Mechanical Features

4 corner mounting holes (3.2mm diameter typical)

Design Compatibility

Compatible with DIP packages, headers, and standard through-hole components

Solder Mask

Typically absent (bare board) unless custom ordered

Silkscreen

Not included (unmarked surface) unless specified