Board Dimensions

2 cm × 8 cm (80 mm × 20 mm)

Material

FR4 (Fiberglass), high-quality and durable

Layers

Double-sided (copper on both sides)

Hole Pitch

2.54 mm (0.1 inch), standard IC and component spacing

Pad Type

Through-hole pads with plated holes for strong solder connections

Copper Thickness

Typically 1 oz (35 µm) per layer

Surface Finish

Bare copper (may require tinning) or HASL (Hot Air Solder Leveling) depending on model

Hole Size

~1 mm (suitable for most through-hole components)

Compatibility

Works with DIP ICs, resistors, capacitors, headers, and other through-hole parts

Applications

Prototyping, DIY projects, circuit testing, educational purposes

Mounting Holes

Usually includes corner holes for secure mounting

Solder Mask

None (bare board) unless specified

Silkscreen

None (unmarked) unless specified