
|
Specification |
|
|
Board Dimensions |
2 cm × 8 cm (80 mm × 20 mm) |
|
Material |
FR4 (Fiberglass), high-quality and
durable |
|
Layers |
Double-sided (copper on both
sides) |
|
Hole Pitch |
2.54 mm (0.1 inch), standard IC
and component spacing |
|
Pad Type |
Through-hole pads with plated
holes for strong solder connections |
|
Copper Thickness |
Typically 1 oz (35 µm) per layer |
|
Surface Finish |
Bare copper (may require tinning)
or HASL (Hot Air Solder Leveling) depending on model |
|
Hole Size |
~1 mm (suitable for most
through-hole components) |
|
Compatibility |
Works with DIP ICs, resistors,
capacitors, headers, and other through-hole parts |
|
Applications |
Prototyping, DIY projects, circuit
testing, educational purposes |
|
Mounting Holes |
Usually includes corner holes for
secure mounting |
|
Solder Mask |
None (bare board) unless specified |
|
Silkscreen |
None (unmarked) unless specified |
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