Dimensions

3 cm × 7 cm (30 mm × 70 mm)

Material

FR4 Fiberglass (rigid, heat-resistant)

Layers

Double-sided (copper on both sides)

Hole Pitch

2.54 mm (0.1 inch) – Standard DIP/through-hole component spacing

Pad Type

Plated through-holes (PTH) for reliable solder joints

Copper Thickness

1 oz (35 µm) per layer (typical)

Surface Finish

Bare copper or HASL (solder-coated) – varies by manufacturer

Hole Diameter

~1 mm (fits most through-hole components)

Solder Mask

None (bare board unless specified)

Silkscreen

None (unmarked unless specified)

Mounting Holes

Often includes 2-4 corner holes (e.g., 3mm diameter)

Compatibility

DIP ICs, resistors, capacitors, headers, LEDs, etc.

Applications

Prototyping, DIY circuits, educational labs, small PCB experiments