
|
Specification |
|
|
Model Number |
PCB-250-254X |
|
Dimensions |
13×25cm (130×250mm) ±1.0mm |
|
Material |
FR4 High-Tg (170°C) |
|
Layers |
Single-sided with reinforced edges |
|
Copper Thickness |
2oz (70μm) base + 30μm plating |
|
Hole Pitch |
2.54mm grid (51×98 holes) |
|
Hole Size |
1.2mm ±0.05mm (heavy-duty
plated-through) |
|
Pad Design |
2.8mm diameter with 1.0mm annular
ring |
|
Surface Finish |
ENIG (Electroless Nickel Immersion
Gold) 3μm |
|
Markings |
Tri-coordinate system
(mm/inch/grid) |
|
Mounting Holes |
8× (M3.5) with copper
reinforcement |
|
Board Thickness |
2.0mm ±0.25mm |
|
Solder Mask |
Matte black (LPI, 25μm) |
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