
|
Specification |
|
|
Physical Dimensions |
20 cm × 30 cm (200 mm × 300 mm) -
Large prototyping area |
|
Board Material |
FR-4 Fiberglass Laminate (1.6mm
thickness standard) |
|
Conductive Layers |
Single-sided copper layer |
|
Copper Thickness |
1 oz (35µm) standard, 2 oz (70µm)
optional |
|
Hole Pattern |
2.54mm (0.1") grid matrix -
Standard DIP component spacing |
|
Hole Specifications |
1.0mm plated through-holes (PTH)
with 2.0mm diameter pads |
|
Surface Finish |
Bare copper (standard) or HASL
lead-free (optional) |
|
Current Capacity |
3A per trace (1oz copper), 5A (2oz
copper) |
|
Thermal Properties |
Maximum operating temperature:
130°C (continuous) |
|
Mechanical Features |
6 mounting holes (4mm diameter) at
corners and mid-sections |
|
Design Compatibility |
Compatible with all through-hole
components and some SMD conversion |
استفسارات العملاء حول المنتج (0)
تسجيل الدخول أو اشتركلتقديم أسئلتك للبائع
No queries have been asked to the seller yet
تُشترى معًا بشكل متكرر
Products from this Seller
عرض الكل
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to