Physical Dimensions

20 cm × 30 cm (200 mm × 300 mm) - Large prototyping area

Board Material

FR-4 Fiberglass Laminate (1.6mm thickness standard)

Conductive Layers

Single-sided copper layer

Copper Thickness

1 oz (35µm) standard, 2 oz (70µm) optional

Hole Pattern

2.54mm (0.1") grid matrix - Standard DIP component spacing

Hole Specifications

1.0mm plated through-holes (PTH) with 2.0mm diameter pads

Surface Finish

Bare copper (standard) or HASL lead-free (optional)

Current Capacity

3A per trace (1oz copper), 5A (2oz copper)

Thermal Properties

Maximum operating temperature: 130°C (continuous)

Mechanical Features

6 mounting holes (4mm diameter) at corners and mid-sections

Design Compatibility

Compatible with all through-hole components and some SMD conversion