Physical Dimensions

12 cm × 18 cm (120 mm × 180 mm) - Large prototyping area

Board Material

FR-4 Fiberglass (1.6mm thickness standard)

Layer Construction

Double-sided with plated through-holes

Copper Thickness

1 oz (35µm) standard, 2 oz (70µm) optional

Hole Pattern

2.54mm (0.1") grid matrix - Standard DIP spacing

Hole Specifications

1.0mm plated through-holes with 2.0mm diameter pads

Surface Finish

Bare copper (standard) or HASL lead-free (optional)

Current Capacity

3A per trace (1oz copper), 5A (2oz copper)

Thermal Rating

Continuous operation up to 130°C

Mounting Features

6 mounting holes (4mm diameter) at strategic locations