
|
Specification |
|
|
Board Dimensions |
5 cm × 7 cm (50 mm × 70 mm) -
Rectangular prototype area |
|
Material Composition |
High-quality FR4 fiberglass
substrate |
|
Layer Configuration |
Double-sided with 1 oz (35µm)
copper cladding on both sides |
|
Hole Pitch Standard |
2.54mm (0.1 inch) grid spacing -
Industry standard for through-hole components |
|
Pad Specifications |
Plated through-holes (PTH) with
1mm diameter (typical) |
|
Surface Treatment |
Bare copper or HASL (Lead-free)
finish available |
|
Thermal Properties |
Tg 130-140°C (standard FR4) |
|
Mechanical Features |
4 corner mounting holes (3.2mm
diameter typical) |
|
Design Compatibility |
Compatible with DIP packages,
headers, and standard through-hole components |
|
Solder Mask |
Typically absent (bare board)
unless custom ordered |
|
Silkscreen |
Not included (unmarked surface)
unless specified |
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