
|
Specification |
|
|
Model Number |
PCB-300-254PRO |
|
Dimensions |
18×30cm (180×300mm) ±1.0mm |
|
Material |
FR4 High-Performance (Tg 180°C) |
|
Copper Weight |
2oz (70μm) base + 35μm plating
(105μm total) |
|
Hole Pattern |
71×118 holes (2.54mm grid) |
|
Plated Through Holes |
1.2mm diameter (25μm copper) |
|
Pad Design |
3.2mm diameter with 1.0mm annular
ring |
|
Surface Finish |
ENIG (3μm Ni/0.05μm Au) |
|
Current Rating |
20A continuous (with proper copper
pours) |
|
Mounting Holes |
12× M4 (with 5mm copper
reinforcement rings) |
|
Board Thickness |
2.4mm ±0.3mm |
|
Thermal Management |
6× heatsink zones (40×40mm each) |
|
Special Features |
Pre-routed power buses (5mm wide) |
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