
|
Specification |
|
|
Dimensions |
3 cm × 7 cm (30 mm × 70 mm) |
|
Material |
FR4 Fiberglass (rigid,
heat-resistant) |
|
Layers |
Double-sided (copper on both
sides) |
|
Hole Pitch |
2.54 mm (0.1 inch) – Standard
DIP/through-hole component spacing |
|
Pad Type |
Plated through-holes (PTH) for
reliable solder joints |
|
Copper Thickness |
1 oz (35 µm) per layer (typical) |
|
Surface Finish |
Bare copper or HASL
(solder-coated) – varies by manufacturer |
|
Hole Diameter |
~1 mm (fits most through-hole
components) |
|
Solder Mask |
None (bare board unless specified) |
|
Silkscreen |
None (unmarked unless specified) |
|
Mounting Holes |
Often includes 2-4 corner holes
(e.g., 3mm diameter) |
|
Compatibility |
DIP ICs, resistors, capacitors,
headers, LEDs, etc. |
|
Applications |
Prototyping, DIY circuits,
educational labs, small PCB experiments |
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