
|
Specification |
|
|
Dimensions |
4 cm × 6 cm (40 mm × 60 mm) |
|
Material |
FR4 Fiberglass (high-quality,
heat-resistant) |
|
Layers |
Double-sided (copper plating on
both sides) |
|
Hole Pitch |
2.54 mm (0.1 inch) – Standard
breadboard & DIP component spacing |
|
Pad Type |
Plated through-holes (PTH) for
strong solder connections |
|
Copper Thickness |
Typically 1 oz (35 µm) per side |
|
Surface Finish |
Bare copper (may require tinning)
or HASL (Hot Air Solder Leveling) |
|
Hole Diameter |
~1 mm (fits most through-hole
components) |
|
Solder Mask |
None (bare board unless specified) |
|
Silkscreen |
None (unmarked unless specified) |
|
Mounting Holes |
Usually includes 2-4 corner holes
(e.g., 3mm diameter) for secure mounting |
|
Compatibility |
DIP ICs, resistors, capacitors,
headers, LEDs, and other through-hole components |
|
Applications |
Prototyping, DIY electronics,
educational projects, circuit testing |
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