
|
Specification |
|
|
Physical Dimensions |
12 cm × 18 cm (120 mm × 180 mm) -
Large prototyping area |
|
Board Material |
FR-4 Fiberglass (1.6mm thickness
standard) |
|
Layer Construction |
Double-sided with plated
through-holes |
|
Copper Thickness |
1 oz (35µm) standard, 2 oz (70µm)
optional |
|
Hole Pattern |
2.54mm (0.1") grid matrix -
Standard DIP spacing |
|
Hole Specifications |
1.0mm plated through-holes with
2.0mm diameter pads |
|
Surface Finish |
Bare copper (standard) or HASL
lead-free (optional) |
|
Current Capacity |
3A per trace (1oz copper), 5A (2oz
copper) |
|
Thermal Rating |
Continuous operation up to 130°C |
|
Mounting Features |
6 mounting holes (4mm diameter) at
strategic locations |
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